NXP is hiring a Process Engineer in Bangkok, Thailand, to support semiconductor back-end manufacturing operations. The role focuses on wafer saw (dicing), blade dicing, backgrind, and DBG processes, including defining and optimizing procedures, maintaining SOPs, leading root cause analysis for defects and yield losses, supporting new product introduction, and collaborating on cost reduction and process improvement projects. Candidates need a bachelor's or master's degree in a relevant engineering field and 3-5 years of process engineering experience with standard backgrind and DBG processes. Strong data analysis and problem-solving skills are required, with experience in SPC, Lean, Six Sigma, or continuous improvement tools considered advantageous. Good command of English is required.






