Process Engineer

NXP is hiring a Process Engineer in Bangkok, Thailand, to support semiconductor back-end manufacturing operations. The role focuses on wafer saw (dicing), blade dicing, backgrind, and DBG processes, including defining and optimizing procedures, maintaining SOPs, leading root cause analysis for defects and yield losses, supporting new product introduction, and collaborating on cost reduction and process improvement projects.

Candidates need a bachelor's or master's degree in a relevant engineering field and 3-5 years of process engineering experience with standard backgrind and DBG processes. Strong data analysis and problem-solving skills are required, with experience in SPC, Lean, Six Sigma, or continuous improvement tools considered advantageous. Good command of English is required.

Define/optimize procedures to ensure smooth processing of production lots

Develop and maintain process documentation and SOPs including operator training

Lead root cause analysis for defects and yield losses

Provide disposition on lots with quality issues

Support new product introduction and process qualification

Bachelor's or master's degree in Engineering (Electronics, Industrial, Chemical, Mechanical, or related field)

3-5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process

Strong data analysis and problem-solving skills

Experience with Statistical Process Control (SPC) and process validation (preferred)

Good command of English language